Reconfigurable Intelligent Surface Optimal Placement in Millimeter-Wave Networks

This work discusses the optimal reconfigurable intelligent surface placement in highly-directional millimeter wave links. In particular, we present a novel system model that takes into account relationship between transmission beam footprint at RIS plane and size. Subsequently, based on derive end-to-end expression of received signal power and, furthermore, provide approximate closed-form expressions case size is either much smaller or least equal to footprint. Moreover, building upon expressions, maximizes signal-to-noise ratio. Finally, substantiate analytical findings by means simulations, which reveal important trends regarding according parameters.